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daA1600-60lc#

The daA1600-60lc Basler dart BCON for LVDS camera module with an e2v EV76C570 color CMOS sensor delivers 60 frames per second at 2 MP resolution.

Basler dart BCON for LVDS Camera Modules

Variants#

The daA1600-60lc is available in the following variants:

  • Bare board: Consists of a circuit board only.
  • S-mount: Consists of a circuit board and a camera front. S-mount lenses can be mounted in the lens mount on the camera front.
  • CS-mount: Consists of a circuit board and a camera front. CS-mount lenses can be mounted in the lens mount on the camera front.

Info

Basler dart S-mount color cameras are not equipped with an IR cut filter. If you want to operate a Basler dart S-mount color camera with an IR cut filter, you must attach a lens with an integrated IR cut filter to the camera.

Specifications#

General Specifications#

daA1600-60lc
Resolution (H x V Pixels) 1600 x 1200
Sensor Type e2v EV76C570 ACT
Progressive scan CMOS
Global shutter
Optical Size 1/1.8"
Effective Sensor Diagonal 9 mm
Pixel Size (H x V) 4.5 μm x 4.5 μm
Frame Rate (at Default Settings) 60 fps
Mono / Color Color
Pixel Formats See Pixel Format.
Synchronization Via hardware trigger
Via software trigger
Via free run
Exposure Time Control Programmable via the camera module's API
Camera Power Requirements ≈1.3 W (typical) @ 5 VDC
I/O Lines 1 input line (CC0) and 2 output lines (two bits on data lane X0)
Lens Mount S-mount, CS-mount, without mount (bare board)
Size (L x W x H) Bare board model: 5.9 mm x 27 mm x 27 mm
S-mount model: 17.5 mm x 29 mm x 29 mm
CS-mount model: 16.9 mm x 29 mm x 29 mm
Weight S-mount and CS-mount models: <15 g
Bare board model: <5 g
Conformity CE (includes RoHS), UL Listed, GenICam 2.4 (including PFNC 1.1 and SFNC 2.1)
Certificates for your camera model
For more information, see the Compliance section of the Basler website.
Software Basler pylon Camera Software Suite (version 5.0.4 or higher)
Available for Windows, Linux x86, Linux ARM, and macOS
Accessories Cables for your camera model
Lenses for your camera model
Additional accessories for your camera model

Spectral Response#

ON Semiconductor AR0134 Spectral Response

The spectral response curve excludes lens characteristics, light source characteristics, and IR cut filter characteristics.

IR Cut Filter#

To achieve best camera performance, Basler recommends using a dielectric IR cut filter.

The filter should transmit in a range from 400–≈700 nm, and it should cut off from ≈700–1100 nm.

  • For the bare board variant, Basler recommends installing an IR cut filter or a lens with an integrated IR cut filter.
  • For the S-mount variant, Basler recommends attaching a lens with an integrated IR cut filter to the camera.
  • On the CS-mount variant, a suitable IR cut filter is already built into the lens adapter (see below).

Integrated IR Cut Filter (CS-Mount Variants Only)#

Basler dart CS-mount color cameras are equipped with an IR cut filter. The filter is mounted in a filter holder inside the lens mount.

The IR cut filter has the following spectral characteristics:

Wavelength [nm] Transmittance
420–600 Tmin ≥ 90 %
Tavg ≥ 92%
650 ± 10 T = 50 %
700–1000 Tavg ≤ 1 %
1000–1100 Tavg ≤ 5 %

Mechanical Specifications#

Dimensions and Mounting Points#

Bare Board Variant

Mechanical Dimensions (in mm) for Bare Board Camera Models

→ Download the CAD/technical drawing for your Basler Camera.

Info

On daA1600-60lm/lc camera models, side-fill material (Loctite E1172A 15G) is injected beneath the sensor. The side-fill material is visible around the sensor. This material optimizes the mechanical robustness of the camera and does not impair camera operation.

S-Mount Variant

Mechanical Dimensions (in mm) for S-Mount Camera Models

→ Download the CAD/technical drawing for your Basler Camera.

CS-Mount Variant

Mechanical Dimensions (in mm) for CS-Mount Camera Models

→ Download the CAD/technical drawing for your Basler Camera.

Maximum Allowed Lens Intrusion#

→ See Maximum Allowed Lens Intrusion.

Stress Test Results#

→ See Stress Test Results.

Requirements#

Environmental Requirements#

Temperature and Humidity#

Description Bare Board Variant S-Mount and CS-Mount Variant
Device temperature during operation 0–75 °C (32–167 °F)a 0–50 °C (32–122 °F)b
Device temperature during storage -20–80 °C (-4–176 °F) -20–80 °C (-4–176 °F)
Humidity 20–80 %, relative, non-condensing 20–80 %, relative, non-condensing
Ambient temperature according to UL 60950-1 max. 50 °C (122 °F) max. 50 °C (122 °F)

UL 60950-1 test conditions: no lens attached to camera; no heat dissipation measures; ambient temperature kept at 50 °C (122 °F).

Heat Dissipation#

→ See Providing Heat Dissipation (dart).

Electrical Requirements#

DANGER – Electric Shock Hazard

Unapproved power supplies may cause electric shock. Serious injury or death may occur.

  • You must use power supplies that meet the Safety Extra Low Voltage (SELV) and Limited Power Source (LPS) requirements.
  • If you use a powered hub or powered switch, they must meet the SELV and LPS requirements.
WARNING – Fire Hazard

Unapproved power supplies may cause fire and burns.

  • You must use power supplies that meet the Limited Power Source (LPS) requirements.
  • If you use a powered hub or powered switch, they must meet the LPS requirements.
NOTICE – Incorrect voltage can damage the camera module.

You must supply camera and I/O power within the safe operating voltage ranges specified below.

Absolute Maximum Ratings#

Pin Name Absolute Minimum Absolute Maximum
VCC -0.3 VDC 6.5 VDC
CC0+
CC0-
-0.3 VDC 4.2 VDC
I2C_SCL
I2C_SDA
I2C_ID
-0.3 VDC 3.6 VDC

Input Voltages#

Pin Name Voltage Type Minimum Nominal (Recommended) Maximum
VCC 4.5 VDC 5.0 VDC 5.5 VDC
CC0+
CC0-
Common mode voltage 0.2 VDC - 1.8 VDC
CC0+
CC0-
Differential voltage 0.1 VDC - -
I2C_SCL
I2C_SDA
I2C_ID
Input low voltage 0.0 VDC 0.0 VDC 1.0 VDC
I2C_SCL
I2C_SDA
I2C_ID
Input high voltage 2.4 VDC 3.3 VDC 3.5 VDC

Output Voltages#

Pin Name Voltage Type Minimum Nominal (Recommended) Maximum
X1-, X1+
X2-, X2+
X3-, X3+
X4-, X4+
XCLK-, XCLK+
Common mode voltage 1.125 VDC 1.25 VDC 1.375 VDC
X1-, X1+
X2-, X2+
X3-, X3+
X4-, X4+
XCLK-, XCLK+
Differential voltage 0.247 VDC - 0.6 VDC

Timing Characteristics#

Pin Name Minimum Maximum Notes
XCLK 12 MHz 84 MHz Selectable via control interface.
Settable in increments of 8.
X0–X3 84 MBaud 588 MBaud Selectable via control interface.
I2C_SCL 0 kHz 400 kHz In the I²C-bus Specification and User Manual, this mode is called "fast-mode" with 400 kbit/s.

For more information about the I/O lines, see the "I/O Control" section.

Cable Requirements#

→ See BCON for LVDS Hardware Design Guide.

Physical Interface#

Connectors and Status LED#

Camera Connectors and Status LED

FFC Connector#

28-pin flat flex cable (FFC) connector. Provides connections for LVDS image transfer, input and output signals, and power supply. Standardized I²C lines are integrated, which are used for camera configuration via the Basler pylon Camera Software Suite.

Status LED#

Indicates operation:

  • LED is blinking slowly: Device is being configured.
  • LED is lit permanently: Device is configured and operative.
  • LED is blinking rapidly: Internal error.

The LED can be turned off permanently by setting the DeviceIndicatorMode parameter to Inactive.

FFC Connector Pin Numbering and Assignments#

Pin 1 Position#

As shown below, pin 1 of the FFC connector is indicated by an arrow, and pin 28 is indicated by the number 28.

FFC Connector Pin Positions

Pin Numbering and Assignments#

Pin # (Camera Side) Pin Name Pin # (System Side) Function
1 GND 28 Power Supplyc
2 VCC 27 Power Supplyd
3 VCC 26 Power Supplyd
4 VCC 25 Power Supplyd
5 GND 24 Power Supplyc
6 I2C_ID 23 Configuration Interfacee
7 I2C_SDA 22 Configuration Interfacef
8 GND 21 Power Supplyc
9 I2C_SCL 20 Configuration Interfaceg
10 GND 19 Power Supplyc
11 CC0- 18 Trigger and General Purpose Inputh
12 CC0+ 17 Trigger and General Purpose Inputh
13 GND 16 Power Supplyc
14 X3- 15 Serial Data Outputi
15 X3+ 14 Serial Data Outputi
16 GND 13 Power Supplyc
17 XCLK- 12 Serial Data Outputi
18 XCLK+ 11 Serial Data Outputi
19 GND 10 Power Supplyc
20 X2- 9 Serial Data Outputi
21 X2+ 8 Serial Data Outputi
22 GND 7 Power Supplyc
23 X1- 6 Serial Data Outputi
24 X1+ 5 Serial Data Outputi
25 GND 4 Power Supplyc
26 X0- 3 Serial Data Outputi
27 X0+ 2 Serial Data Outputi
28 GND 1 Power Supplyc

Precautions#

→ See Safety Instructions (dart).

Installation#

→ See Camera Installation.

Features#

→ See the camera features section.


  1. Temperature measured at the temperature measurement point, i.e., at the hottest point on the board. This point is significantly hotter than the other parts on the board.

  2. Temperature measured at the temperature measurement point, i.e., at the camera front.

  3. All GND pins, including the five shield GND contacts on the opposite side of the connector, must be connected to a common GND plane. Avoid long PCB traces, prefer direct vias.

  4. Single camera supply voltage, 5 VDC nominal. Connect all pins.

  5. I²C interface address selector. Connect to GND for an I²C slave address of 0x3C. Connect to 3.3 VDC for an I²C slave address of 0x3D.

  6. I²C interface data line. A pull-up resistor to 3.3 VDC is required. Refer to the I²C-bus Specification and User Manual for the appropriate resistor value. Note that FFCs can have a significant line capacitance.

  7. I²C interface clock line. A pull-up resistor to 3.3 VDC is required. Refer to the I²C-bus Specification and User Manual for the appropriate resistor value. Note that FFCs can have a significant line capacitance.

  8. LVDS input to the camera, mainly as external trigger. No termination resistor is required at the system side. In the pylon API, the input line is designated as Line 3.

  9. LVDS output data lane. Use differential routing. A 100 ohm termination resistor is required across the differential pair.