Stress Test Results (dart BCON for MIPI)#
Cameras were submitted to an independent mechanical testing laboratory and subjected to the stress tests listed below. The mechanical stress tests were performed on selected camera models. After mechanical testing, the cameras exhibited no detectable physical damage and produced normal images during standard operational testing.
|Sine (each axis)||DIN EN 60068-2-6||10–58 Hz / 1.5 mm; 58–500 Hz / 20 g; 1 Octave/Minute |
|Shock (each axis)||DIN EN 60068-2-27||20 g / 11 ms / 100 shocks positive |
20 g / 11 ms / 100 shocks negative
|Random (each axis)||DIN EN 60068-2-64||15-500 Hz / 0.05 PSD (ESS standard profile) / 00:30 h|
The mechanical stress tests for S-mount cameras were performed with a dummy lens attached. The dummy lens had a mass of 30 g. Using a heavier lens requires an additional support for the lens.
Bare board cameras: Because the circuit board of bare board models is the same as the circuit board of S-mount and CS-mount models, individual stress tests are not carried out for bare board cameras.