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daA4200-30mci#

The daA4200-30mci Basler dart BCON for MIPI camera module with an ON Semiconductor AR1335 color CMOS sensor delivers 30 frames per second at 13 MP resolution.

Basler dart BCON for MIPI Camera Modules

Variants#

The daA4200-30mci is available in the following variants:

  • Bare board: Consists of a circuit board only.
  • S-mount: Consists of a circuit board and a camera front. S-mount lenses can be mounted in the lens mount on the camera front.

Info

Basler dart S-mount color cameras are not equipped with an IR cut filter. If you want to operate a Basler dart S-mount color camera with an IR cut filter, you must attach a lens with an integrated IR cut filter to the camera.

Specifications#

General Specifications#

daA4200-30mci
Resolution (H x V Pixels) 4208 x 3120
Sensor Type ON Semiconductor AR1335
Progressive scan CMOS
Rolling shutter
Optical Size 1/3.2"
Effective Sensor Diagonal 5.76 mm
Pixel Size (H x V) 1.1 μm x 1.1 μm
Frame Rate (at Default Settings) 30 fps
Mono / Color Color
Pixel Formats See Pixel Format.
Synchronization Via software trigger
Via free run
Exposure Time Control Programmable via the camera module's API
Camera Power Requirements 1.35 W (typical) @ 5 VDC & 1200 MBit/s
I/O Lines 2 input lines and 2 output lines
Lens Mount S-mount, without mount (bare board)
Size (L x W x H) Bare board model: 27 mm x 27 mm x 5.3 mm
S-mount model: 29 mm x 29 mm x 17.5 mm
Weight S-mount model: <10 g
Bare board model: <5 g
Conformity CE (includes RoHS), FCC, UL Listed, GenICam 2.4 (including PFNC 1.1 and SFNC 2.1), KC
Certificates for your camera model
For more information, see the Compliance section of the Basler website.
Software Basler pylon Camera Software Suite (version 5.1 or higher)
Available for Windows, Linux x86, Linux ARM, and macOS
Accessories Cables for your camera model
Lenses for your camera model
Additional accessories for your camera model

Spectral Response#

ON Semiconductor AR1335 Spectral Response

The spectral response curve excludes lens characteristics and light source characteristics.

IR Cut Filter#

To achieve best camera performance, Basler recommends using a dielectric IR cut filter.

The filter should transmit in a range from 400–≈700 nm, and it should cut off from ≈700–1100 nm.

  • For the bare board variant, Basler recommends installing an IR cut filter or a lens with an integrated IR cut filter when integrating the camera into the system.
  • For the S-mount variant, Basler recommends attaching a lens with an integrated IR cut filter to the camera.

Mechanical Specifications#

Dimensions and Mounting Points#

Bare Board Variant (daA4200-30mci Only)

Mechanical Dimensions (in mm) for Bare Board Camera Models

→ Download the CAD/technical drawing for your Basler Camera.

S-Mount Variant

Mechanical Dimensions (in mm) for S-Mount Camera Models

→ Download the CAD/technical drawing for your Basler Camera.

Maximum Allowed Lens Intrusion#

→ See Maximum Allowed Lens Intrusion.

Stress Test Results#

→ See Stress Test Results.

Requirements#

Environmental Requirements#

Temperature and Humidity#

Description Bare Board Variant S-Mount and CS-Mount Variant
Device temperature during operation 0–75 °C (32–167 °F)a 0–50 °C (32–122 °F)b
Device temperature during storage -20–80 °C (-4–176 °F) -20–80 °C (-4–176 °F)
Humidity 20–80 %, relative, non-condensing 20–80 %, relative, non-condensing
Ambient temperature according to UL 60950-1 max. 50 °C (122 °F) max. 50 °C (122 °F)

UL 60950-1 test conditions: no lens attached to camera; no heat dissipation measures; ambient temperature kept at 50 °C (122 °F).

Heat Dissipation#

→ See Providing Heat Dissipation (dart).

Electrical Requirements#

DANGER – Electric Shock Hazard

Unapproved power supplies may cause electric shock. Serious injury or death may occur.

  • You must use power supplies that meet the Safety Extra Low Voltage (SELV) and Limited Power Source (LPS) requirements.
  • If you use a powered hub or powered switch, they must meet the SELV and LPS requirements.
WARNING – Fire Hazard

Unapproved power supplies may cause fire and burns.

  • You must use power supplies that meet the Limited Power Source (LPS) requirements.
  • If you use a powered hub or powered switch, they must meet the LPS requirements.
NOTICE – Incorrect voltage can damage the camera module.

You must supply camera and I/O power within the safe operating voltage ranges specified below.

Absolute Maximum Ratings#

Pin Name Absolute Minimum Absolute Maximum
VCC -0.3 VDC 6.0 VDC
I2C_SCL
I2C_SDA
-0.3 VDC 2.0 VDC
IO_CamIn0
IO_CamIn1
-0.3 VDC 2.0 VDC

Supply Current#

Pin Name Notes Nominal (Recommended) Maximum
VCC Maximum power to be provided via the VCC pins is 2.5 W at 5 VDC nominal supply voltage. Varies by camera module type 0.5 A

Input Voltages#

Pin Name Notes Minimum Nominal (Recommended) Maximum
VCC Recommended ramp up time: > 1ms
Ripple: < 1%
4.5 VDC 5.0 VDC 5.5 VDC
I2C_SCL
I2C_SDA
IO_CamIn0
IO_CamIn1
Input high voltage 1.3 VDC 1.8 VDC 1.9 VDC
I2C_SCL
I2C_SDA
IO_CamIn0
IO_CamIn1
Input low voltage 0.0 VDC 0.0 VDC 0.5 VDC

Output Voltages#

Pin Name Notes Minimum Nominal (Recommended) Maximum
IO_CamIn0
IO_CamIn1
Output high voltage 1.2 VDC - -
IO_CamIn0
IO_CamIn1
Output low voltage - - 0.5 VDC
VOD MIPI clock and data lanes, HS Mode 140 mV - 270 mV
VCMTX MIPI clock and data lanes, HS Mode 150 mV - 250 mV
VOL MIPI clock and data lanes, LP Mode -50 mV - 50 mV
VOH MIPI clock and data lanes, LP Mode 1.1 VDC - 1.3 VDC

Timing Characteristics#

Pin Name Minimum Maximum Notes
IO_CamIn0
IO_CamIn1
0 kHz 100 kHz -

I²C Interface Specification#

The I²C interface follows the I²C-bus specification.

MIPI D-PHY Interface Specification#

The MIPI D-PHY clock and data lanes follow the MIPI D-PHY v1.0 specification.

D-PHY Trace Lengths and Delays#

The table below shows the traces lengths and approximated signal delays of the D-PHY interface on the camera module.

Info

Signal delay values were calculated assuming signal velocity of 6 ns/m.

Signal Name Trace Length [mm] Signal Delay [ps]
CLK+ 21.58 129
CLK- 21.60 130
D1+ 21.62 130
D1- 21.60 130
D2+ 21.56 129
D2- 21.60 130
D3+ 21.59 130
D3- 21.59 130
D4+ 21.63 130
D4- 21.59 130

Cable Requirements#

→ See BCON for MIPI Hardware Design Guide.

Physical Interface#

The dart BCON for MIPI camera modules comply with the MIPI CSI-2 specification. For more information, visit www.mipi.org/specifications/csi-2.

Connectors#

Camera Connectors

FFC Connector#

The 28-pin connector on the camera is a flexible flat cable (FFC) connector by Hirose Electric Co. The connector provides connections for image transfer, input and output signals, and power supply. Standardized I²C lines are integrated, which are used for camera configuration via the Basler pylon Camera Software Suite.

The connector is specifically designed for shielded and impedance-controlled flexible flat cables. However, standard flexible flat cables without a ground layer can also be inserted. They will make good electrical contact, but you may notice a high rate of bit errors.

The connector order code is Hirose FH41-28S-0.5SH(05).

FFC Connector Pin Numbering and Assignments#

Pin 1 Position#

As shown below, pin 1 of the FFC connector is indicated by an arrow, and pin 28 is indicated by the number 28.

FFC Connector Pin Positions

Pin Numbering and Assignments#

Pin # (Camera Side) Pin Name Pin # (System Side) Function
Ground contacts - - GNDc
1 GND 28 Power Supplyc
2 VCC 27 Power Supplyd
3 VCC 26 Power Supplyd
4 VCC 25 Power Supplyd
5 IO_CamOut0 24 GPOe
6 IO_CamOut1 23 GPOe
7 GND 22 GNDc
8 I2C_SDA 21 Configuration interfacef
9 I2C_SCL 20 Configuration Interfaceg
10 GND 19 GNDc
11 IO_CamIn0 18 GPIh
12 IO_CamIn1 17 GPIh
13 GND 16 GNDc
14 D1- 15 Data Outputi
15 D1+ 14 Data Outputi
16 GND 13 GNDc
17 D2- 12 Data Outputi
18 D2+ 11 Data Outputi
19 GND 10 GNDc
20 CLK- 9 Clock Outputi
21 CLK+ 8 Clock Outputi
22 GND 7 GNDc
23 D3- 6 Data Outputi
24 D3+ 5 Data Outputi
25 GND 4 GNDc
26 D4- 3 Data Outputi
27 D4+ 2 Data Outputi
28 GND 1 GNDc

Precautions#

→ See Safety Instructions (dart).

Installation#

→ See Camera Installation.

Features#

→ See the camera features section.


  1. Temperature measured at the temperature measurement point, i.e., at the hottest point on the board. This point is significantly hotter than the other parts on the board.

  2. Temperature measured at the temperature measurement point, i.e., at the camera front.

  3. All GND pins, including the five shield GND contacts on the opposite side of the connector, must be connected to a common GND plane. Avoid long PCB traces, prefer direct vias.

  4. Single camera supply voltage, 5 VDC nominal. Connect all pins.

  5. Single-ended general purpose output line 0/1 (e.g., flash or strobe signal).

  6. I²C interface data line. A pull-up resistor to 1.8 VDC is required on the system side. Refer to the I²C-bus Specification and User Manual for the appropriate resistor value. Note that FFCs can have a significant line capacitance.

  7. I²C interface clock line. A pull-up resistor to 1.8 VDC is required on the system side. Refer to the I²C-bus Specification and User Manual for the appropriate resistor value. Note that FFCs can have a significant line capacitance.

  8. Single-ended general purpose input line 0/1 (e.g. trigger signal).

  9. MIPI D-PHY data lane negative/positive pin.