The daA1600-60um is available in the following variants:
- Bare board: Consists of a circuit board only.
- S-mount: Consists of a circuit board and a camera front. S-mount lenses can be mounted in the lens mount on the camera front.
- CS-mount: Consists of a circuit board and a camera front. CS-mount lenses can be mounted in the lens mount on the camera front.
Basler dart S-mount color cameras are not equipped with an IR cut filter. If you want to operate a Basler dart S-mount color camera with an IR cut filter, you must attach a lens with an integrated IR cut filter to the camera.
|Resolution (H x V Pixels)||1600 x 1200|
|Sensor Type||e2v EV76C570 ABT |
Progressive scan CMOS
|Effective Sensor Diagonal||9 mm|
|Pixel Size (H x V)||4.5 μm x 4.5 μm|
|Frame Rate (at Default Settings)||60 fps|
|Mono / Color||Mono|
|Image Data Interface||USB 3.0, nominal max. 5 Gbit/s (SuperSpeed)|
|Pixel Formats||See Pixel Format.|
|Synchronization||Via hardware trigger |
Via software trigger
Via free run
|Exposure Time Control||Programmable via the camera API|
|Camera Power Requirements||≈1.3 W (typical) @ 5 VDC|
|I/O Lines||2 general purpose I/O (GPIO) lines|
|Lens Mount||S-mount, CS-mount, without mount (bare board)|
|Size (L x W x H)||S-mount and CS-mount models: 20 mm x 29 mm x 29 mm |
Bare board model: ≈8.3 mm x 27 mm x 27 mm
|Weight||S-mount and CS-mount models: <15 g |
Bare board model: <5 g
|Conformity||CE (includes RoHS), UL Listed, GenICam 2.x (including PFNC 1.x and SFNC 2.x), USB3 Vision, REACH, KC |
Certificates for your camera model
For more information, see the Compliance section of the Basler website.
|Software||Basler pylon Camera Software Suite (version 4.2 or higher) |
Available for Windows, Linux x86, Linux ARM, and macOS
|Accessories||Cables for your camera model |
Lenses for your camera model
Additional accessories for your camera model
The spectral response curve excludes lens characteristics and light source characteristics.
Dimensions and Mounting Points#
Bare Board Variant (daA1600-60um/uc Only)
On daA1600-60um/uc camera models, side-fill material (Loctite E1172A 15G) is injected beneath the sensor. The side-fill material is visible around the sensor. This material optimizes the mechanical robustness of the camera and does not impair camera operation.
Maximum Allowed Lens Intrusion#
Stress Test Results#
→ See Stress Test Results.
Temperature and Humidity#
|Description||Bare Board Variant||S-Mount and CS-Mount Variant|
|Device temperature during operation||0–75 °C (32–167 °F)a||0–50 °C (32–122 °F)b|
|Device temperature during storage||-20–80 °C (-4–176 °F)||-20–80 °C (-4–176 °F)|
|Humidity||20–80 %, relative, non-condensing||20–80 %, relative, non-condensing|
|Ambient temperature according to UL 60950-1||max. 50 °C (122 °F)||max. 50 °C (122 °F)|
UL 60950-1 test conditions: no lens attached to camera; no heat dissipation measures; ambient temperature kept at 50 °C (122 °F).
DANGER – Electric Shock Hazard
Unapproved power supplies may cause electric shock. Serious injury or death may occur.
- You must use power supplies that meet the Safety Extra Low Voltage (SELV) and Limited Power Source (LPS) requirements.
- If you use a powered hub or powered switch, they must meet the SELV and LPS requirements.
WARNING – Fire Hazard
Unapproved power supplies may cause fire and burns.
- You must use power supplies that meet the Limited Power Source (LPS) requirements.
- If you use a powered hub or powered switch, they must meet the LPS requirements.
NOTICE – Incorrect voltage can damage the camera module.
You must supply camera and I/O power within the safe operating voltage ranges specified below.
You must supply camera power that complies with the Universal Serial Bus 3.0 specification.
The nominal operating voltage is 5 VDC, effective on the camera module's connector.
General Purpose I/O Lines#
The camera module has two direct-coupled GPIO lines that are accessed via contact 3 and 4 of the I/O connector on the back of the board.
The GPIO lines have the following characteristics:
- They can be configured to operate as inputs or outputs.
- They are called line 1 and line 2.
- They are directly connected to the FPGA (unbuffered, see circuit diagram). Therefore, they are not protected against overcurrent or overvoltage.
- They are on the same electrical potential as the circuit board.
- They are compatible with low-voltage TTL (LVTTL) signals. To make the camera module compatible with standard TTL signals, attach the optional dart I/O board.
- They are protected against electrostatic discharge (ESD) strikes of up to 2 kV (contact discharge). The tests were performed according to the EN61000-4-2 standard.
- By default, they are configured as input lines. Due to their high impedance, inputs are susceptible to noise and electromagnetic interference (EMI). For long cables or in harsh electromagnetic environments, the use of active converter circuits may be necessary.
If you require a specific output logic level at all times, add a suitable pull-up or pull-down resistor. If you use a pull-down resistor, the resistor value should be 1.8 kΩ or greater so that the current limit is not exceeded.
NOTICE – Applying incorrect electrical signals to the GPIO lines may severely damage the camera module.
Before you connect any external circuitry to the GPIO lines, use the Line Mode feature to configure the line as an input or output line.
If a GPIO line is configured as an output line, never short-circuit the line.
Before you apply signals to the GPIO lines, connect the camera module to a USB port.
Make sure to apply appropriate input or output signal voltages as specified below.
Operation as Input
|4.2 VDC||Absolute maximum. This voltage must never be exceeded. Doing so may damage the camera and voids the warranty.|
|0–3.4 VDC||Safe operating range. The minimum external pull-up voltage is 3.3 VDC.|
|0–0.7 VDC||Indicates a logical 0 (with inverter disabled).|
|1.8–3.4 VDC||Indicates a logical 1 (with inverter disabled).|
- Maximum input leakage current: 10 μA
- Internal pull-up resistor: 25 kΩ typical, 7 to 41 kΩ.
- To increase the voltage allowed on the I/O input lines, attach the optional dart I/O board. The I/O board makes the camera module compatible with TTL input signals.
Operation as Output
|3.4 VDC||Absolute maximum. This voltage must never be exceeded. Doing so may damage the camera and voids the warranty.|
|0–0.5 VDC||Indicates a logical 0 (with inverter disabled).|
|2.4–3.3 VDC||Indicates a logical 1 (with inverter disabled).|
Maximum current allowed through the output circuit: 2 mA
For more information about the I/O lines, see the I/O Control section.
USB 3.0 Cable#
- Use a high-quality USB 3.0 cable with a USB 3.0 Micro-B plug.
- Do not use cables with a USB 1.x/2.0 Micro-B cable plug, even if you are connecting the camera module to a USB 2.0 port. Otherwise, the module may not work properly.
- To avoid EMI, cables must be shielded, as specified in the USB 3.0 standard.
- Basler recommends using USB 3.0 cables from the Basler Vision Components range.
For more information, see the Recommended Accessories for Basler USB 3.0 Cameras document.
- The camera-side connector must be terminated with a 1.27 mm pitch dual-row plug.
- The cable must be wired to conform with the pin assignments shown below.
- Basler recommends using I/O cables from the Basler Vision Components range.
USB 2.0 Compatibility#
All Basler dart USB 3.0 camera modules are USB 2.0 backward compatible.
However, performance is limited when connected to a USB 2.0 port:
- In order to handle the lower USB 2.0 bandwidth, the
DeviceLinkThroughputLimitparameter value is set to 32 000 000 (32 MByte/s).
- This reduces the maximum possible frame rate.
- This also affects other aspects of the performance, e.g., the sensor readout time, trigger delay, jitter, or the precision of the exposure time set.
- If you operate a daA1280-54um/uc camera module on a USB 2.0 port, image noise may increase. This is because the image sensor produces more image noise at low frame rates. To reduce image noise at low frame rates, try the following:
For information about suitable USB 2.0 host controllers and about optimizing the USB 2.0 data transmission rate, see the Recommended USB 2.0 Host Controllers for Basler dart and pulse Cameras application note.
Connectors and Status LED#
6-pin socket connector with a 1.27-mm pitch dual-row receptacle. Provides access to the I/O lines.
USB 3.0 Connector#
The camera module's USB 3.0 connector is a standard Micro-B USB 3.0 connector. It provides a nominal 5 Gbit/s SuperSpeed data transfer connection to supply power to the device and to transmit video data and control signals.
Connection assignments and numbering adhere to the Universal Serial Bus 3.0 standard. The recommended mating connector is any standard Micro-B USB 3.0 plug.
Depending on how you integrate the Basler dart into your system, you must select a corresponding USB 3.0 connector that matches the orientation of the dart USB 3.0 connector in the mounted position. The orientation of the USB 3.0 connector is shown in the figure above.
- LED is blinking slowly: Device is being configured.
- LED is lit permanently: Device is configured and operative.
- LED is blinking rapidly: Internal error.
The LED can be turned off permanently by setting the
DeviceIndicatorMode parameter to
I/O Connector Pin Numbering and Assignments#
|1||-||3.3 VDC; max. 20 mA |
Power output. Do not apply any external voltage.
|3||Line 1||General purpose I/O (GPIO) line |
Preset: Input line
|4||Line 2||General purpose I/O (GPIO) line |
Preset: Input line
The dart I/O board is available from Basler. It has the following benefits:
- Offers additional I/O connectors instead of the single standard I/O connector.
- Increases the voltage allowed on the I/O input lines (TTL compatibility).
- Allows you to trigger multiple dart USB 3.0 camera modules simultaneously.
- Protects the camera module against short circuits.
The board can be mounted on the back of the Basler dart circuit board. The connectors of the I/O board replace the standard I/O connector.
Contact your Basler sales representative to order the dart I/O board.
For more information, see the dart I/O board Technical Specification.
→ See Camera Installation.
→ See the camera features section.